Stretchable and foldable silicon-based electronics
نویسندگان
چکیده
منابع مشابه
Stretchable and foldable silicon integrated circuits.
We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon compl...
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Silicon (Si) nanowire (NW) coils were fabricated on elastomeric substrates by a controlled buckling process. Si NWs were first transferred onto prestrained and ultraviolet/ozone (UVO)-treated poly(dimethylsiloxane) (PDMS) substrates and buckled upon release of the prestrain. Two buckling modes (the in-plane wavy mode and the three-dimensional coiled mode) were found; a transition between them w...
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Patterned structures of flexible, stretchable, electrically conductive materials on soft substrates could lead to novel electronic devices with unique mechanical properties allowing them to bend, fold, stretch or conform to their environment. For the last decade, research on improving the stretchability of circuits on elastomeric substrates has made significant progresses but designing printed ...
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All commercial forms of electronic/optoelectronic technologies use planar, rigid substrates. Device possibilities that exploit bio-inspired designs or require intimate integration with the human body demand curvilinear shapes and/or elastic responses to large strain deformations. This article reviews progress in research designed to accomplish these outcomes with established, high-performance i...
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Stretchable electronics is a revolutionary technology that will potentially create a world of radically different electronic devices and systems that open up an entirely new spectrum of possibilities. This article proposes a microfluidic based solution for stretchable radio frequency (RF) electronics, using hybrid integration of active circuits assembled on flex foils and liquid alloy passive s...
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ژورنال
عنوان ژورنال: Applied Physics Letters
سال: 2017
ISSN: 0003-6951,1077-3118
DOI: 10.1063/1.4979545